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半導体材料開発エンジニア

Hitachi Chemical Co., Ltd.

  • Salary ⁨¥⁩⁨5,800,000⁩ - ⁨8,550,000⁩
  • Work Location Ibaraki
  • Company employee count Over 10,000
  • Link to this company's homepage. Company Homepage

Job Summary

半導体実装材料の研究開発において、基板材料・プロセス設計・アッセンブリー材料の各グループで材料開発や製造法の研究を行います。5Gや6Gなどの次世代通信に対応する材料設計、試作、評価、改良を行い、最終的にスマートフォンやPC、自動車などの製品発展に寄与する技術を追求します。

Company Info

Hitachi Chemical Co., Ltd. was a leading chemical company that specialized in the production of a wide range of chemical products, including basic chemicals, fine chemicals, and functional materials. Its product portfolio encompassed electronic materials such as semiconductor die bonding materials and epoxy molding compounds, electrical insulating varnishes, inorganic materials like carbon products, resin materials such as adhesive films and films for display circuit connection, and wiring board materials. The company also offered advanced components and systems, including automobile parts, storage devices and systems (e.g., vehicle and industrial batteries), and electronic components like wiring boards. Hitachi Chemical Co., Ltd. was established in 1962, independent from Hitachi Ltd., and was headquartered in Tokyo, Japan. The company was acquired by Showa Denko K.K. in April 2020, and its name changed to Showa Denko Materials Co., Ltd. in October 2020. In January 2023, Showa Denko K.K. and Showa Denko Materials Co., Ltd. merged to form Resonac Corporation.

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