半導体材料開発エンジニア
日立化成株式会社
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¥5,800,000 - 8,550,000
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Ibaraki
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Over 10,000
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Company Homepage
Job Summary
半導体実装材料の研究開発において、基板材料・プロセス設計・アッセンブリー材料の各グループで材料開発や製造法の研究を行います。5Gや6Gなどの次世代通信に対応する材料設計、試作、評価、改良を行い、最終的にスマートフォンやPC、自動車などの製品発展に寄与する技術を追求します。Company Info
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