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DISCO Corporation

Job Summary

半導体製造装置や実験設備向けの画像処理ソフトウェア開発を担当します。主な業務は、VisualStudioを使用したC++およびC#による画像処理ソフト開発、画像処理アルゴリズムの設計・検討、ならびに試運転・検証・デバッグ作業です。

Company Info

DISCO Corporation is a Japanese manufacturer of precision machines and precision processing tools, primarily for the semiconductor and electronic components industries. The company specializes in three core processing technologies: cutting (Kiru), grinding (Kezuru), and polishing (Migaku). Its product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, and various precision tools like dicing blades and grinding wheels. DISCO's equipment and tools are used to process materials such as silicon, sapphire, and gallium arsenide wafers, making them smaller, thinner, and highly polished.

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