要素技術（次世代ICパッケージ基板量産に向けたプロセス開発）
IBIDEN CO.,LTD.
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Gifu
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Under 10
Job Summary
【業務概要】 次世代ICパッケージ基板量産に向けた各工程のプロセス条件や機械加工・測定手法の開発 【募集の背景】 半導体(ICチップ)の微細化が物理的に限界を迎えており、ICパッケージ基板の付加価値が上がっています。パソコンだけでなく、データセンター向けに高機能なICパッケージ基板が必要であり、2021年4月に生産能力増強を目的とした設備投資計画(1,800億円)を発表、世界最先端の半導体に求められる技術レベルを実現するため、プロセス開発ができる人材の確保が必要になります。 【特徴・魅力】 豊富な知識・経験があれば、若手でも、各工程のプロセス条件や機械加工・測定手法の開発テーマをリーダーとして遂行できます。 【配属部門】 電子事業本部 技術統括部 要素技術部Company Info
IBIDEN CO.,LTD. is a Japanese electronics company headquartered in Ogaki, Gifu prefecture, established in 1912. The company is primarily engaged in the manufacture of electronic and ceramic products, operating in two main business segments. The Electronics segment focuses on the manufacture and sale of printed circuit boards (PCBs) and package substrates, including the design of PCB patterns. The Ceramics segment offers environment-related ceramic products, special carbon products, fine ceramic products, and ceramic fibers. Ibiden also concentrates on producing cutting-edge materials and electronic parts and is committed to conducting business in an environmentally friendly manner, prioritizing eco-friendly production and renewable energy sources.Login to see all information about offers.
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